Corporate Outline

Corporate Name Toray Engineering Co.,Ltd.
Established August 10, 1960
Chairman of the Board Shinichi Okuda
President & CEO Susumu Ota
Head Office Yaesu Ryumeikan Building, 3-22, Yaesu 1-chome, Chuo-ku, Tokyo 103-0028, Japan
Capital ¥1,500 million
Shareholder Toray Industries, Inc.
Number of Employees 841 (Toray Engineering Only) (as of April 1, 2017)
2,229 (including subsidiaries)
Sales in Fisical Year of 2016 ¥102.5 billion in consolidation
Board of Director and Company Organization pdfClick to view PDF file.
Main businesses and products From large-scale plant construction to manufacturing / inspection equipments for semiconductors, FPDs, secondary batteries and solar panels, in the technical capabilities with "Engineering and Monozukuri", we provide the optimal solution to customers' increasingly sophisticated and diverse needs.

Engineering Business Division
  1. Plant Engineering: Medical/Pharmaceutical and Life science plants, Chemical plants, Environment and Energy related material plants, Carbon fiber plants, Support for overseas plant expansion
  2. Film Manufacturing Equipment: Stretched film manufacturing equipment, Coaters, Laminators, Slitters, Roll-to- roll dry deposition equipment (CVD/sputter), Dry and wet manufacturing equipment for thin film solar cells
  3. Factory Automation Systems: IT systems / Pecision control / Cleaning / Labor saving for factories (Aircraft / Automobile / Electrical and Electronic / Food / Medicine / Fuel cell factories)
  4. Integrated Secondary Battery Production Equipment & Systems: Powder supply / Mixing / Coating / Pressing / Slitting / Sheet cutting / Stacking / Tab welding / Electrode filling / Heat sealing / Charge and Discharge testing, Testing systems and Various inspections, Automatic production systems, Traceability, Prototyping and Evaluation of secondary battery
  5. Software: Injection molding CAE systems, Scientific computing and Various simulations, Factory management systems, Production management systems
Electronics Division
  1. FPD, Semiconductor-related Bonding, Sealing and Processing Equipment: Bonder, Vacuum printing encapsulation system, Roll-to-roll exposure systems, ID making equipment, Laser patterning equipment, Thermal imprinting system
  2. Coater for FPD-related Applications: Toray slit-nozzle coater, Roll-to-roll coating equipment, Ink-jet coating equipment, Various types of coating equipment
  3. FPD and Semiconductor Inspection Equipment: 3D non-contact surface profiling equipment, Wafer inspection equipment, Chip inspection system, System for inspecting wafers for internal defects, Overlay measurement system, High-speed microbump measurement system, LED light emission inspection system, Organic pattern inspection system, Particle inspection system for FPD, Bali / Lib defect inspection equipment, Color unevenness detection system
  4. Environmental/Process - Related Measuring/Controlling Equipment and Devices: Oxygen analyzers, Water quality meters, Transducers, Mixing nozzles, System equipment for production control
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