Cell Positioning, Bonding and Attachment Equipment

Using roll-to-roll to deliver void-less attachment with high alignment accuracy.

High-accuracy positioning technology

Technology for high-speed positioning (alignment) of two objects.
Achieves high-speed, high-precision positioning in conjunction with various technologies, such as technology for high-precision recognition of the position of marks for positioning, and damping technology for suppressing vibration which can cause positioning error.

High-accuracy positioning technology

Bonding technology

We support a variety of bonding processes based on know-how we have developed with semiconductor and LCD IC bonding, including: ultrasonic and thermo-compression bonding, and NCP and ACF processes.

Ultrasonic Bonding

Ultrasonic Bonding

NCP Process

NCP Process


Back contact cell bonding

Back contact cell bonding

System for automatic conversion of back contact cells to bonding sheets

System for automatic conversion of back contact cells to bonding sheets

Related Products

Roll to Roll Compatible Bonder CF2000R

Roll to Roll Compatible Bonder CF2000R

Bonder for Large-sized Substrates MD3500

Bonder for Large-sized Substrates MD3500

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Bonding/Encapsulation Technology
High-reliability Printing Equipment
Cell Positioning, Bonding and Attachment Equipment
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LCD, OLED and PDP
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