High-reliability Printing Equipment

Technology for void-less screen printing of resin.
Technology for screen printing electrodes with a high aspect ratio at high positioning accuracy.

Vacuum printing

Printing is done in a vacuum to suppress the occurrence of voids.

1st printing process (Vacuum 1Torr)

2nd printing process (Vacuum 40Torr)


Differential pressure filling

Unfilled parts are filled with resin using vacuum differential pressure

2nd printing process (Vacuum 40Torr)

Vacuum release (Atmospheric pressure 760Torr)


Electrode formation for cells

  1. Alignment accuracy ±5µm (Accuracy at alignment mark position)
  2. Line width: 60µm, Line height: 30μm (Depends on material. Two-pass coating in some cases)
  3. Tact time: 3 sec or less (With one-pass coating)

Electrode formation for cells

Related Products

Vacuum Printing System for Large-sized Substrates VE6500

Vacuum Printing System for Large-sized Substrates VE6500

Example of silver electrode printing and overcoating

Example of silver electrode printing and overcoating


Specifications

Printing Piece BGA, CSP, PWB, FPC, etc
Printing Area Max. 510W – 610L [mm]
Mask Size 700 × 700 – 1000 × 1000 [mm]
Alignment Function Automatic alignment performed by image processing system
Alignment Accuracy ±50 µm
Cycle Time 50 sec/cycle (Excluding printing time)
Special Attachments Off contact function
Dimensions 3875(W) × 3810(L) × 2470(H) [mm]
Weight Approx. 8,000 [kg]

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Bonding/Encapsulation Technology
High-reliability Printing Equipment
Cell Positioning, Bonding and Attachment Equipment
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Semiconductors
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