3-D Non-Contact Surface Profiling Equipment

Enables non-contact measurement of steps and film thickness!!
— Toray Engineering's SP Series enables non-contact, high-accuracy, simultaneous measurement of the thickness of TCO, a-Si and metal films —

Non-contact, high-accuracy measurement with white-light interferometry

Non-contact, high-accuracy measurement with white-light interferometry

Non-contact, high-accuracy measurement with white-light interferometry
Non-contact, high-accuracy measurement with white-light interferometry

Measurement Examples

Related Products  Surface Profiler, SP Series

SP-700A/500A

SP-700A/500A
From R&D to mass-production applications!

SP-700PA/500PA

SP-700PA/500PA
For large substrates. No need to cut out samples!

SP-700WA/500WA

SP-700WA/500WA
Fully automatic inspection of crystal surfaces


SP Series Specifications

SPEC
Measurement principal Optical interferometry
Vertical scanning interferometry(VSI), Phase shift interferometry(PSI)
Vertical scanning range 0 – MAX 400µm
Vertical scanning speed MAX 214µm/sec
Height display resolution 0.001µm/0.01nm (switchable)
Intereference objective lens 10×, 2.5×, 5×, 20×, 50×

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Inspection/Measurement Technology
3-D Non-Contact Surface Profiling Equipment
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