Line Type COG Bonder CL2000FW



Substrate size [mm] Two panel conveyance 20L × 20W-165L × 120W
One panel conveyance 20L × 20W-275L × 165W t=0.4 × 2-1.1 × 2
Substrate types Glass (LCD)
Chip size [mm] *1 4L × 1W × 0.4t-20L × 5W × 0.8t
Number of chip types 2
Chip orientation Face up / Face down
Cycle time *2 4.5 [sec/chip]
Alignment accuracy (3σ) *3 ±2.5 [µm] (X,Y)
Bonding accuracy (3σ) *3 ±5 [µm] (X,Y)
Bonding force [N] *4 ACF lamination : 9.8-147
Pre-bonding : 19.6-196
Main bonding : 19.6-294
Heated tool temperature [°C] ACF lamination : RT-150 Constant heater
Pre-bonding : RT-350 Ceramic heater
Main bonding : RT-350 Ceramic heater
Power 3-phase, AC200V ±10%, 50/60Hz±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 15kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 3790W × 1800D × 2050H
Weight [kg] Approx. 3300

*1 Longer chips (Max.28L) can be processed with an optional heated tool.
*2 Cycle time varies depending on processing conditions.
*3 Accuracy measurement is conducted using Toray-standard substrates.

Line Construction

Line Construction


  1. Load cell
  2. Vacuum pump
  3. Ionizer
  4. Top cover
  5. HEPA filter
  6. Multiple heads for main bonding unit
  7. Edge cleaning unit
  8. Atmospheric plasma cleaning unit
Line Type COG Bonder CL2000FW
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
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