Line Type COG Bonder CL3000

Features

Specifications

Substrate size [mm] Two panel conveyance 15L × 15W-231L × 168W
One panel conveyance 15L × 15W-350L × 200W
Substrate thickness [mm] t=0.2 × 2-1.1 × 2(≦4") · t=0.4 × 2-1.1 × 2 (4"<)
Substrate types Glass (LCD)
Chip size [mm] 4L × 0.7W-28L × 5W
Number of chip types 2
Chip orientation Face up / Face down
Cycle time *1, 2 3.5 [sec/chip] (Target)
ACF lamination accuracy (Range) [mm] *3 ±0.2(X), ±0.1(Y)
Bonding accuracy (3σ) *1, 3 ±4 [µm](X,Y) Target
Bonding force [N] ACF lamination : 4.9-14.7
Pre-bonding : 19.6-49
Main bonding : 19.6-490
Heated tool temperature [°C] ACF lamination : RT-120 Constant Heater
Pre-bonding : RT-100 Constant Heater
Main bonding : RT-350 Ceramic Heater
Power 3-Phase, AC200V ±10%, 50/60Hz ±1Hz 15kVA
Air pressure [MPa] Dry air 0.49-0.59 (800 L/Min.)
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 5640W × 1832D × 1470H
Weight [kg] Approx. 5800

Notes
*1 Provisional result
*2 Cycle time varies depending on processing conditions.
*3 Accuracy, measured when Toray-standard COG work components, processing and operation conditions are applied.

Line Construction

Line Construction

Options

  1. Loadcell
  2. Vacuum pump
  3. Ionizer
  4. Top cover
  5. HEPA filter
  6. Edge cleaning unit
  7. Atmospheric plasma cleaning unit
Line Type COG Bonder CL3000
Bonders
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
Inquiry
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