Semi Automatic ACF Transfer DA1000

Features

Specifications

Substrate size [mm] 35L × 20W-150L × 120W
Substrate material Glass (FPC)
ACF width [mm] 2.0-10.0 *1
ACF transfer length [mm] 4.0-40.0
ACF material producer Sony Chemicals / Hitachi Chemical, etc
ACF transfer accuracy [mm] ±0.2(W) ±0.4(L)
Number of ACF transfer points 1
Cycle time 5.0 [sec/place] *2
Laminating force [N] 19.6-196
Heated tool temperature [°C] RT-150 : constant heater
Power 3-phase, AC100V ±10%, 50Hz/60Hz 2kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80 (ejector equipped)
Dimensions [mm] Approx. 700W × 600D × 1400H
Weight [kg] Approx. 200

Notes
*1 Wider ACF is applicable, with optional equipment.
*2 Does not include thermal compression time and panel change time.
*3 Does not include thermal compression time, inspection time and panel change time.

Options

  1. Air cooling unit
  2. Step-down transformer
  3. ACF width 10mm-22mm

Optional Equipment

Optional Equipment

 Semi Automatic ACF Transfer DA1000
Bonders
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
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