Semi Automatic Main Bonder DM1000

Features

Specifications

Substrate size [mm] 35L × 20W-150L × 120W
Substrate material Glass, (FCP)
Chip dimensions [mm] 6.0L × 1.0W × 0.4t-20L × 5.0W × 0.8t
Number of chip types 1
Cycle time *1 5.0 [sec/place]
Protect head mechanism teflon tape
Bonding force [N] 19.6-196
Heated tool temperature [°C] RT-350 : ceramic heater
Power 3-phase, AC100V ±10%, 50Hz/60Hz, 3kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80 (ejector equipped)
Dimensions [mm] Approx. 700W × 600D × 1400H
Weight [kg] Approx. 200

Notes
*1 Does not include processing time (i. e. head touchdown, bonding and vacuum release)

Options

  1. Heat stage
  2. Step-down transformer

Optional Equipment

Optional Equipment

Semi Automatic Main Bonder DM1000
Bonders
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
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