Reel to Reel COF Bonder FC3100
Features
- Shortest cycle time of 1.8 [sec/chip] can be attained, compatible with high alignment accuracy of ±1.5 [µm] (3 sigma)
- 12 inch size wafer (maximum) can be applied, enabling supply selection from various chip types.
- The system is exchangeable between thermo-compression process and ultrasonic bonding process,by a simple and on-the-spot changeover.
- Ultrasonic bonding head is fixed on a unique structure-DSS (Dual Support System), enabling bonding of chips loaded with multiple bumps at relatively low temperatures and thereby making it most suited for ultra-fine pitch patterns.
- Compact design and equipment layout are offered specifically with emphasis on easy maintenance work.
Specifications
| Substrate size [mm] | 35, 48, 70, t=0.025-0.07 | |
|---|---|---|
| Substrate types | COF (Reel type) | |
| Chip size [mm] | Thermo-compression process *1 | 3L × 3W-20L × 20W, t=0.15-1.0 |
| Ultrasonic bonding process *2 | 3L × 3W-15L × 15W, ï½”=0.3-0.8 | |
| Number of chip types | 1 | |
| Chip orientation | Face up (Wafer 6", 8", 12" or Waffle Tray 2", 3"）(Waffle Tray 4" possible with an option) | |
| Cycle time *3 | 1.8 [sec/chip] | |
| Alignment accuracy (3σ) *4 | ±1.5 [µm] (X,Y) | |
| Bonding force [N] | 9.8-490 | |
| Bonding head type | Ultrasonic head | 50 [kHz], 150 [W], temperature RT, 100 [°C], 150 [°C], 180 [°C], 200 [°C] |
| Ceramic heater head | temperature RT-450 [°C] | |
| Power | 3-phase, AC200V ± 10%, 50/60Hz ± 1Hz or 3-phase, AC220V ± 10%, 50/60Hz ± 1Hz, 10kVA | |
| Air pressure [MPa] | Dry air 0.49 | |
| Vacuum [kPa] | -80 | |
| Equipment dimensions [mm] | Approx. 1730W × 1420D × 1600H (Dimensions of substrate loading/unloading unit are not included.) | |
| Weight [kg] | Approx. 2500 (subject to change) | |
Notes
*1 Slim chip (Min. 3L × 1W) and large-sized chip (Max. 30L × 30W) can be processed with an optional heat tool.
*2 Slim chip (Min. 3L × 1W) and long chip (Max. 28L × 10W) can be processed with an optional horn.
*3 Under full-auto dry running operation, excluding processing time.
*4 Accuracy measurement is taken using Toray-standard substrates.
Process
The system is exchangeable between thermo-compression process and ultrasonic bonding process, by a simple and on-the-spot change-over.
Options
- Vacuum pump
- Ionizer
- Pre-heat & post-heat stage
- Wafer mapping
- Dispenser
