Line Type COG Bonder FG2000



Substrate size [mm] 20L × 20W-130L × 130W, t=0.3 × 2-1.1 × 2
Chip size [mm] 3L × 1W-30L × 5W, t=0.3-1.0
Number of chip types 2
Chip orientation Face down (Face up possible with an optional unit)
Cycle time *1 5.5 [sec/chip]
Alignment accuracy (3σ) *2 ±2.5 [µm](X,Y)
Bonding accuracy (3σ) *2 ±5 [µm](X,Y)
Bonding force [N] ACF lamination : 9.8-196
Pre-bonding : 19.6-196
Main bonding : 19.6-490
Heated tool temperature [°C] ACF lamination : RT-150 Constant heater
Pre-bonding : RT-100 Constant heater *3
Main bonding:RT-350 Ceramic heater
Power 1-phase, AC220V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz±1Hz, 10kVA
Air pressure [MPa] Dry air 0.49-0.59
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 3860W × 1515D × 1570H
Weight [kg] Approx. 2000

*1 Cycle time varies depending on processing conditions.
*2 Accuracy measurement is conducted using Toray-standard substrates.
*3 It can be exchanged to ceramic heater (RT-350 [°C]), as an option.

Line Construction

Line Construction


  1. FOG function
  2. Ionizer
  3. Vacuum pump
  4. HEPA filter
  5. Top cover
  6. Loadcell
  7. Chip flipper
Line Type COG Bonder FG2000
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
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