Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000

Features

Specifications

Substrate size [mm] COG 20L × 20W-130L × 130W, t=0.3 × 2-1.1 × 2
FOG 20L × 20W-110L × 130W, t=0.3 × 2-1.1 × 2 (Outline dimensions)
COF 20L × 20W-100L × 100W, t=Min. 0.02
Chip or FPC size [mm] LSI 3L × 1W ×-30L × 5W, t=0.3-1.0
FPC 25L × 20W-60L × 60W, t=Min. 0.02
Number of types LSI 1 or 2
FPC 1
Chip orientation Face up or Face down
Cycle time *1 4.0 [sec/chip]
Alignment accuracy (3σ) *2 ±2.5 [µm] (X,Y)
Bonding accuracy (3σ) *2 ±4 [µm] (X,Y)
Bonding force [N] ACF lamination:9.8-196
Pre-bonding:19.6-196
Main bonding:19.6-490
Heated tool temperature [°C] ACF lamination : RT-150 Constant heater
Pre-bonding : RT-150 Constant heater *3
Main bonding : RT-350 Ceramic heater
Power 1-phase, AC220V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA
Air pressure [MPa] Dry air 0.49-0.59
Vacuum [kPa] -80
Equipment dimensions [mm] *4 Approx. 3860W × 1508D × 1570H
Weight [kg] *4 Approx. 4000

Notes
*1 Cycle time, obtained when Toray-stardard COG work components, processing and operation conditions are applied.
*2 Accuracy, measured when Toray-stardard COG work components, processing and operation conditions are applied.
*3 Exchangeable to a ceramic heater (RT-350°C), as an optional feature.
*4 Dimensions and weight of unloading conveyor unit are not included.

Line Construction

Line Construction

Options

  1. FOG function
  2. COF function
  3. COG / FOG one-path
  4. Ionizer
  5. Heat stage
  6. Vacuum pump
  7. HEPA filter
  8. Top cover
  9. Loadcell
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Bonders
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
Inquiry
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