Semi-Automatic COG Bonder SA2000
Features
- A wide range of applications is possible ; from R&D work or small-sized panel production to repair work for large-sized panels.
- Productivity can be improved further by applying ACF lamination and the main bonding units (optional).
- Automatic alignment mechanism helps make high bonding accuracy, compatible with product variations.
- Chip loader is equipped as standard.
- A wide range of bonding conditions is possible to set, through implementation of a 8-step temperature and force control.
- As high pressurization bonding-head is used, the system enables main bonding as well as pre-bonding.
Specifications
| Substrate size [mm] *1 | 40L × 40W-350L × 280W t=0.4 × 2-1.1 × 2 |
|---|---|
| Substrate types | Glass (LCD) |
| Chip size [mm] *2 | 4L × 1W × 0.4t-20L × 5W × 0.8t |
| Number of chip types | 2 |
| Chip orientation *3 | Face down |
| Cycle time *4 | 5 [sec/chip] |
| Alignment accuracy (3σ) *5 | ±2.5 [µm] (X,Y) |
| Bonding accuracy (3σ) | ±5 [µm] (X,Y) |
| Bonding force [N] | 19.6-294 |
| Heated tool temperature [°C] | RT-350 Ceramic heater |
| Power | 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA |
| Air pressure [MPa] | Dry air 0.49 |
| Vacuum [kPa] | -80 |
| Equipment dimensions [mm] | Approx. 1260W × 2070D × 1750H |
| Weight [kg] | Approx. 1900 |
Notes
*1 Smaller-sized substrates (Min.20L × 20W) can be processed with an optional stage.
*2 Longer chips (Max.28L) can be processed with an optional heated tool.
*3 Faced-up chip types can be loaded with an optional flipper unit.
*4 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*5 Accuracy measurement is conducted using Toray-standard substrates.
Options
- Ionizer
- Vacuum pump
- Load cell
- Top cover
- HEPA filter
- Heated tool for longer chips (Max. 28L)
- Flipper unit for faced-up chip types
Optional Equipment
