Semi-Automatic COG Bonder SA2000

Features

Specifications

Substrate size [mm] *1 40L × 40W-350L × 280W t=0.4 × 2-1.1 × 2
Substrate types Glass (LCD)
Chip size [mm] *2 4L × 1W × 0.4t-20L × 5W × 0.8t
Number of chip types 2
Chip orientation *3 Face down
Cycle time *4 5 [sec/chip]
Alignment accuracy (3σ) *5 ±2.5 [µm] (X,Y)
Bonding accuracy (3σ) ±5 [µm] (X,Y)
Bonding force [N] 19.6-294
Heated tool temperature [°C] RT-350 Ceramic heater
Power 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 1260W × 2070D × 1750H
Weight [kg] Approx. 1900

Notes
*1 Smaller-sized substrates (Min.20L × 20W) can be processed with an optional stage.
*2 Longer chips (Max.28L) can be processed with an optional heated tool.
*3 Faced-up chip types can be loaded with an optional flipper unit.
*4 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*5 Accuracy measurement is conducted using Toray-standard substrates.

Options

  1. Ionizer
  2. Vacuum pump
  3. Load cell
  4. Top cover
  5. HEPA filter
  6. Heated tool for longer chips (Max. 28L)
  7. Flipper unit for faced-up chip types

Optional Equipment

Optional Equipment

Semi-Automatic COG Bonder SA2000
Bonders
Reel to Reel COF Bonder FC3100
Fully-Automatic COG/FOG/COF Bonder (for LSIs or FPCs) FG3000
Line Type COG Bonder FG2000
Line Type COG Bonder CL3000
Line Type COG Bonder CL2000FW
Semi-Automatic COG Bonder SA2000
Semi Automatic ACF Transfer DA1000
Semi Automatic Main Bonder DM1000
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