Polyimide Etching

Using our patented, safe chemical agents, this is a revolutionary new method of polyimide film etching for new forms of semiconductor packages such as CSP and T-BGA.

Product List

Chemical Etching Technology for Polyimide Film and the Solution TPE3000

Polyimide film can be processed for blind-via or through-hole formation by chemical etching.

Product Overview

Chemical Etching Process

Chemical Etching ProcessThis process enables etching of a large number of via holes of different types on the same substrate, at a lower cost than laser processing.

Through-hole Sample

Through-hole SampleFilm thickness: 25 microns
Hole size: 50 microns ~ a few hundred microns

Chemical Etching Sample

Chemical Etching SampleThis process can form not only round holes, but also lattice-shaped holes which cannot be achieved with lasers. Applications include TAB, BGA and CSP.

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Fine Patterning
FPC, TAB and COF Lines
Polyimide Etching
Organic Pattern Inspection System
RtoR Thermal imprint system
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