Chemical Etching Technology for Polyimide Film and the Solution TPE3000

Features

Specifications

Object Material Polyimide, 2-layer materials (cast, sputtered)
Side Wall Angle Cu mask: 55-65 deg.
DFR: 40-45 deg.
Etching Rate (Fig.-1)
Operating Temperature 60-90 °C
Appearance Transparent and colorless liquid
Specific Density 1.273 (25 °C)
PH About PH13 (when diluted 100 times)
Regulation Poisonous and Deleterious Substances Control Law, Deleterious Substance (IMDG8, IATA8)
Waste Chemical Processing Vendor pickup

Etching Performance(Fig.-1)

Etching Performance

Example of mixed processes (Flying-lead, Blind via-holes, Through-holes)

Example of mixed processes (Flying-lead, Blind via-holes, Through-holes)

Flying-leadFlying-lead
Blind-viaBlind-via

Through-hole for liquid crystal polymer"Through-hole for liquid crystal polymer"
At present, liquid crystal polymers are commercially available from a number of companies.
Some polyimide substrates may be replaced with liquid crystal polymers, but we have developed etching solutions for liquid crystal polymers as a new series of the polyimide etching solution "TPE3000".
The photo shows an example of processing with a liquid crystal polymer thickness = 125µm and a bottom diameter = 400µm.

Chemical Etching Technology for Polyimide Film and the Solution TPE3000
Polyimide Etching
Chemical Etching Technology for Polyimide Film and the Solution TPE3000
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