Laser Micro Trimming EquipmentLaser Micro Trimming Equipment

Achieving remove failure LED chip on glass substrate or wafer by laser ablation

The laser wavelength can be changed for the work material. The laser spot diameter can be changed to 2 um-square.
Achieving remove failure LED chips and cut unnecessary wiring.

Example

Specification

Substrate size ~□470㎜, ~ 12 inch
Laser wavelength 1064nm / 532nm / 355nm / 266nm
Tact time Depend on trimming specifications.
Processing precision ±2μm
  • Related terms
    • Direct processing
    • High speed machining
    • High precision machining
    • Patterning
    • Laser processing

Inquiries

Technological Field
Technology >> Laser processing > Laser Patterning Equipment "HWS series"
Industry Sector
Industry sector >> Fibers & films > Film processing machines