Chip Inspection System GEN3000T

Automatically performs surface inspection of individual semiconductor chips

GEN3000NT

Overview

GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.

Features

  • DSI algorithm.
  • Continuous inspections by index transportation.
  • High-accuracy feed-forward processing.
  • Correction of Chip thickness and inclination with high-precision displacement sensor.
  • Chip cleaning (front surface).
  • High-clean class corresponded by "Clean box".
  • Automatic correction of collet positioning.
  • Replacement with sorting by chip status: (Pass/Fail).
  • Backside inspection and cleaning during chip transportation.

DSI algorithm

The system memorizes the characteristics of several good chips and creates a statistical image including process variations. By comparing the statistical image and the image of the item to be inspected, the algorithm helps to reduce false defects and enables automatic inspections as visual checks for accuracy. The defect inspection algorithm has a proven track record in our INSPECTRA®, wafer defect inspection system.

Continuous inspections enabled by index transportation.

Chips are loaded onto the table on top of the index transfer turntable using a loading/unloading robot, the outline position is determined, the back side is vacuumed and the chips are sent downstream. The corrective calculation optical system of downstream detect any offsetting in chip position and angle, and feed forward all position and angle data to inspection optical systems further downstream. Inspection optical systems moves and waits at the appropriate inspection position based on that position and angle data while the turntable is revolving and, once the table stops, is able to perform quick, highly reliable inspections as a result of that high-precision positioning.

High-accuracy feed-forward processing

Data is passed between units to achieve a coherent system: by installing only the unit that measures the degree of positional correction required in the early stages of the inspection and performing those corrections by calibrating the relative amount displayed by the inspection unit.

Correction of Chip thickness and inclination with high-precision displacement sensor.

The correction station uses a laser displacement meter to correct the chip’s thickness and tilt, using this information to perform inspection.

Chip cleaning (front surface)

The GEN3000T features a powerful cleaner upstream in the corrective calculation optical system. The powerful cleaner removes dust particles on chip surfaces and between bumps that can cause incorrect readings. The chips that failed inspection can be judged again and storaged after multiple cleanings and re-inspection.

High-clean class corresponded by "Clean box"

The chip transporting section of the GEN3000T is encased in a clean box, except for the motor, which is a dust source. Clean air is pumped in thereinside and the interior is maintained at positive pressure. By making an opening in the area where the user views the interior during inspections, and extracting the air within the box the interior of the box are kept at high clean standards.

Automatic correction of collet positioning

After replacing the collet, the position and angle of the collet is measured using images and any offset from the standard position of the transportation device is corrected. This correction ensures that a constant chip position is maintained.

Replacement with sorting by chip status : (Pass/Fail)

Based on the results of the inspection, the loading/unloading robot sorts chips into two trays: one for those that passed and one for those that need reviewing. Chips that could not be image-measured for correction purposes and those that contained defects in excess of the allowable degree are not sent to either of the aforementioned trays; they are destroyed instead. Chips sorted into the “passed” tray are ready for shipping, while those deemed to need reviewing are subjected to a visual inspection, thus dramatically reducing the burden incurred through visual inspections.

Backside inspection and cleaning during chip transportation

Chips are removed from their trays and, while being conveyed to the index table, are cleaned, image scanned and inspected. This means that reverse-side inspections have no effect on Takt time.

Specifications

Inspection method DSI comparison method
Stage stroke 30mm x 30mm
Single perspective measurement Time 0.3 sec. or less/perspective
Inspection magnification 2.0x (5 um)
5x (2.0 um)
10x (1.0 um)
Tray size 2, 3, 4 inch, etc.
Lighting LED lighting for both epi-illumination and oblique lighting
Index number 8 (45 degree feed)
Main options Dark field, backside inspection, backside cleaning, traceability

Inquiries

Technological Field
Technology >> Image processing > Exterior Inspection
Industry Sector
Industry sector >> Semiconductors > Semiconductor inspection equipment