High-speed Bump Measurement system "MB-3000"
High speed bump shape measurement, height measurement, and surface inspection with a single system!
The MB-3000 is a high-speed, high-precision bump measuring system that employs a confocal approach to height measurement and uses a DSI algorithm for surface inspection.
- High-precision height measurement using confocal measurement
- DSI algorithm for pattern inspection
- Also capable of 2D inspection (bump diameter, presence, misalignment)
- Function for analyzing defect bumps using color images
|Measured bumps||Shape: Ball/post
Diameter: 20um and larger
Height: 0um to 50um
Wafer sizes: Up to 300 mm
|Tact speed (300mm)||3.9WPH（3D）
|Surface inspection function||Quality product learning algorithm
PAD inspection function
- Related terms
- Cu post
- 3D packaging
- CONTACT US
Shiga office: +81-77-544-1635