Surface Profiler measurement system "SP series"
Non-contact, non-destructive measurement of nm-order surface shapes
SP series, high accuracy 3D surface profiler measurement system with white light interferometry.
Transparent film measurement system
It is possible to measure up to 50 nm thin film and transparent film, moreover the product with transparent film impreviously by "Our original algorithm".
The product with a film which is not able to be measured by other system nor other algorithm can be measured with sufficient accuracy.This system is perfect for customers who want to perform non-destructive measurement but don’t have the equipment to do so.
- Transparent film on transparent substrate
- Surface/Interface configuration/Interface thickness of transparent substrate
- Surface/Interface configuration of transparent film
- Bump height "on or through" transparent film
- Distribution of film thickness differently than general film thickness measurement
High scanning speed
Vertical scanning speed: 214µm/sec* meet the needs of making quick scanning time possible as market requests
Bump and TSV automated measurement with automated asperity measurement Micro bump, TSV, deep-trench can be contactless measured with high accuracy "Automated asperity measurement" can measure the following items.
- Height variation and position gap of bump
- Diameter of bump top and bump bottom
- Coplanarity of measurement area
- Cubic volume
- Depth and diameter of TSV
- Depth of deep trench
Range of models for different applications.
|装置特長||Perfect for research and development uses such as sample measurement of a large number of sample types under various conditions!||Built-in automatic XY stage.Contains automatic Z axis and autofocus functions.||Supports sizes up to 12 inches.Supports automatic bump inspection and OK/fail evaluation.
Optimal for production management.
|Attachment type, mountable in a variety of devices.|
|Product Line-up||Manual Type||Semi-Automatic type||For wafers||Module type|
|Interference objective lenses||2x, 5x, 10x, 20x, 50x|
|Camera||Standard: 1/3 inch (effective pixels: 512 x 480)
Option: 2/3 inch (effective pixels: 1376 x 1040)
|Height display resolution||0.001um/0.01nm (switchable)|
|Size of stage||150mm×150mm||200mm×200mm||Wafers:||—|
|Vertical operation range||Standard: 0 to 100 um
Option: 0 to 400 um
|Standard components||Surface shape measurement software, 3D shape display software, transparent film measurement function (SP-700 only), vibration elimination platform, etc.|
|Option||Automatic bump measurement software, multifunction 3D shape display software, stitching software, high-speed camera, active vibration elimination platform, etc. Customization available|
|Measurement examples||Bumps, Trench, Wafer roughness, LED (PSS), SiC Etchi-Pits, Film, Transparent Film, PV, etc…|
* 1, *2 According to studies performed by Toray Engineering
- Related terms
- Transparent film measurement
- Micro bump
- Etch pit categorization
- KOH etching
- Trench measurement
- CONTACT US
Shiga office: +81-77-544-1635