Semiconductor Production Equipment
As the semiconductor industry rapidly moves towards miniaturization and high-precision, we offer unique and leading edge solutions represented by our flip chip bonders.
Flip Chip Bonders
These are flip chip bonders used for the application of semiconductor packages.
We can meet a wide range of needs, from R&D to mass production.
Our lineup has a variety of bonders for TSV 3D mounting, FOWLP, optical devices, and other purposes.