OF2000

Super High Accuracy Flip Chip Bonder (for optical devices)

OF2000

Overview

Super high accuracy flip chip bonders for miniature chips such as optical devices.
Fully automatic machine equipped with tray-fed chip loader, as well as substrate loading and unloading functions.

Features

  • "Unique Ceramic Heater Head" and "Fine Substrate Stage Leveling System," wide-range profile control is available.
    In addition, it can achieve excellent surface stability.
  • Through the vibration-proof design and environment temperature auto-calibration software, stable productivity and durability are maintained.
  • By adopting an "air bearing" in the bonding head, excellent low pressure bonding operation is achieved.

Optional functions

Anti-vibration device; bonding inspection unit, etc.

Specifications for OF2000

Substrate size(mm) 2–20 mm long x 2–20 mm wide (t=0.1–1.0 mm)
Chip size(mm) 0.2–10 mm long x 0.2–10 mm wide (t=0.1–1.0 mm)
Cycle time(*1) / Cycle time 15sec/chip substrate handing 15sec
Alignment accuracy (3σ) ±0.5μm(X,Y) ±0.2°(0)(*2)
Bonding force(N) 0.049-9.8
Heat tool temperature(℃) RT-500 Ceramic heater
Stage temperature(℃) RT-500 Ceramic heater

NOTES
*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 200 μm

Inquiries

  • CONTACT US
  • Tokyo office: +81-3-3241-1769

    Shiga office: +81-77-544-6221

Technological Field
Technology >> Encapsulation, bonding, flip chip > Flip Chip Bonders
Industry Sector
Industry sector >> Semiconductors > Flip Chip Bonders