Vacuum Printing Encapsulation System



We have unique printing systems that use vacuum technology.
Capable of void-less and low-stress coating, and can be used in the manufacture of highly reliable devices in a variety of fields.Can reduce cost and time for product changeover by utilizing mask printing method.
A semi-automatic machine, suited for conducting R&D work and mass production.Can also be used as a fully automatic machine.


  • The system ensures achievement of void-less encapsulation and via-hole filling.
  • The system is applicable to variety of products by setting multiple parameters.
  • The system has a built-in cleaning unit for cleaning the backside of mask.

Optional functions

  • CCD camera monitor
  • Substrate loading / unloading unit
  • Image processor
  • Silent box for vacuum pump

Specifications for VE500C

Packages BGA、CSP、COB、WLP、LED etc.
Printing area 200 mm wide × 200 mm long
Vacuum level (Max) 130Pa
Print head Double squeegee
Resin supply method Dispenser
Equipment dimensions Approx. 1,800 mm wide × 1,000 mm deep × 1,600 mm high
Weight Approx. 1,200 kg
Power 3-phase AC200±10%、50Hz/60Hz or 3-phase AC220±10%、50Hz/60Hz、18kV
  • Related terms
    • Vacuum
    • Printing
    • Encapsulation
    • LED
    • Multilayer substrate
    • Hole filling
    • Void-less


  • Tokyo office: +81-3-3241-1769

    Shiga office: +81-77-544-6221

Technological Field
Technology >> Encapsulation, bonding, flip chip > Vacuum Printing Encapsulation System
Industry Sector
Industry sector >> Semiconductors > Vacuum Printing Encapsulation System