Vacuum Printing Encapsulation System
We have unique printing systems that use vacuum technology.
Capable of void-less and low-stress coating, and can be used in the manufacture of highly reliable devices in a variety of fields.Can reduce cost and time for product changeover by utilizing mask printing method.
The system is applicable to batch encapsulation of 12-inch wafer.
- The system is applicable to batch encapsulation of 12-inch wafer.
- The system ensures achievement of void-less encapsulation and via-hole filling.
- The system is applicable to variety of products by setting multiple parameters.
- The system is applicable to substrates of large sizes. (Max. 420 × 420 mm)
CCD camera monitor; double syringe; silent box for vacuum pump, etc.
Specifications for VE700C
|Printing area||420 mm wide × 420 mm long|
|Vacuum level (Max)||130Pa|
|Print head||Double squeegee|
|Resin supply method||Dispenser|
|Equipment dimensions||Approx. 2,710 mm wide × 1,560 mm deep × 1,950 mm high|
|Weight||Approx. 3,500 kg|
|Power||3-phase AC220±10V, 50Hz/60Hz±1Hz, 20A|
- CONTACT US
Tokyo office: +81-3-3241-1769
Shiga office: +81-77-544-6221