Spot Reflow System

The unique local heating technology realizes reflow of heat sensitive substrates / parts!

Test equipment

Tabletop machine

Capacitor mounting on PET substrate

FPC bonding to plastic

LED mounting on cloth

It is a device that solder heat-sensitive substrates / parts by local heating.

Features

With our proprietary induction heating method, it is possible to locally heat (selectively heat) the joint without contact. We realize soldering to heat sensitive material which is difficult in conventional reflow furnace. In addition, compared with conventional reflow ovens, energy saving and space saving are achieved

Application

Component mounting on PET substrate
FPC bonding to resin casing
Component mounting on resin molded products (3D-MID etc.)
LED mounting
Wearable mounting
e.t.c.

  • Related terms
    • local heating

Inquiries

  • CONTACT US
  • Tokyo office: +81-3-3241-1769

    Shiga office: +81-77-544-1892

Technological Field
Technology >> Encapsulation, bonding, flip chip > Spot Reflow System
Industry Sector
Industry sector >> Semiconductors > Spot Reflow System