Spot Reflow System
The unique local heating technology realizes reflow of heat sensitive substrates / parts!
It is a device that solder heat-sensitive substrates / parts by local heating.
With our proprietary induction heating method, it is possible to locally heat (selectively heat) the joint without contact. We realize soldering to heat sensitive material which is difficult in conventional reflow furnace. In addition, compared with conventional reflow ovens, energy saving and space saving are achieved
Component mounting on PET substrate
FPC bonding to resin casing
Component mounting on resin molded products (3D-MID etc.)
- Related terms
- local heating
- CONTACT US
Tokyo office: +81-3-3241-1769
Shiga office: +81-77-544-1892