Manual Type Flip Chip Bonder (for R&D Purpose) FC100M

Features

Specification

Substrate size [mm] 3L × 3W-120L × 120W t=0.025-3
Substrate types Glass Epoxy, FPC, Ceramics, etc.
Chip size [mm] Thermo-compression process *1 0.5L × 0.5W-20L × 20W t=0.05-1
Ultrasonic bonding process *2 1L × 1W-10L × 10W t=0.3-1
Number of chip types 1
Chip orientation Face down
Bonding force [N] High pressure head 9.8-392
Low pressure head 2.0-50
Bonding head type Ultrasonic head 50Khz 150W temperature RT, 100 [°C] , 150 [°C] , 180 [°C] , 200 [°C]
Ceramic heater head temperature RT-450 [°C]
Power 3-phase, AC200V ± 10%, 50/60Hz ± 1Hz or 3-phase, AC220V ± 10%, 50/60Hz ± 1Hz, 10kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 1100W × 1050D × 1950H
Weight [kg] Approx. 1000

Notes
*1 Slim chip (Min. 1.0mm Wide) and large-sized chip (Max. 30.0mm Long × 30.0mm Wide) can be processed with an optional heat tool.
*2 Slim chip (Min. 1.0mm Wide) and long chip (Max. 28.0mm Long × 10.0mm Wide) can be processed with an optional horn.

Options

  1. Heat stage
  2. Ceramic heat stage (20 × 20mm)
  3. Air-gyro stage
  4. Gel-pack
  5. Ionizer
  6. Vacuum pump
  7. Slant Light
  8. X&Y-axes digital indicator
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Bonders
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Flip Chip Bonder (for RF-ID Tag) CF2000R
Inquiry
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