Flip Chip Bonder (for MCM/COF/CSP) FC2000 series



Substrate size [mm] 50L × 30W-120L × 120W *1 t=0.5-1.6
Substrate types Glass Epoxy, FPC, Ceramic etc
Chip size [mm] 3L × 3W × 0.3t-20L × 20W × 1.0t
Number of chip types 1-4 *2
Chip orientation Face down *3
Cycle time 1.8 [sec/chip] *4 with an optional chip loader
Alignment accuracy (3σ) ±2 [µm] (X, Y) *5
Bonding force [N] Ultra-low pressure head : 0.049-9.8
Standard head : 1.96-294
High pressure head for ultrasonic : 9.8-392
Low Pressure head for ultrasonic : 2.0-50
Heat tool temperature [°C] RT-450 Ceramic heater (Thermo-compression)
Horn temperature [°C] (Ultrasonic-processing) RT, 100, 150, 180, 200
Power 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 1300W × 1240D × 1970H
Weight [kg] Approx.1500

*1 Larger size substrates (MAX. 300L × 250W) can be processed with an optional S-axis.
*2 Chips, up to 10 different types, can be loaded with an optional multiple chip loader.
*3 Faced-up chip types can be loaded with an optional chip loader.
*4 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*5 Accuracy measurement is conducted using Toray-standard substrates.

Process option

Applications NCP ACP ACF Solder Au-Sn Au-Au Ag Paste
Ultra-low pressure head *1 *1
Standard head
Ceramic heat stage

Paste transfer


N2 Purge

Z-axis control

Ultrasonic engine

*1 Required in the case that there are only a few bumps.


  1. Glass backup stage
  2. S-axis attachment (for larger substrates)
  3. Load cell
  4. Ionizer
  5. Vacuum pump
  6. Chip loader (tray / multiple types) *
  7. Substrate loader / unloader *
  8. Automatic thermo-calibration
  9. Data logger

* By adding a chip loader unit and a substrate loader / unloader unit a fully automatic process can be obtained.

 Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Flip Chip Bonder (for RF-ID Tag) CF2000R
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