Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Features
- New image processing technology, high alignment accuracy of ±2µm (3 sigma)
- Cycle time of 1.8sec/chip
- Off-line programming resulting in shortened change-over time
- Unique ceramic heater, air slide bearing head, high-speed temperature profile and fine pressure control for various bonding conditions
- Automatic tool change and leveling function by NC control, Multi-Chip-Module capability
- With an optional bonding head used for both thermo-compression and ultrasonic processing, packaging of devices with high pin count is possible at low temperature and with a short tact time
Specifications
Substrate size [mm] | 50L × 30W-120L × 120W *1 t=0.5-1.6 | |
---|---|---|
Substrate types | Glass Epoxy, FPC, Ceramic etc | |
Chip size [mm] | 3L × 3W × 0.3t-20L × 20W × 1.0t | |
Number of chip types | 1-4 *2 | |
Chip orientation | Face down *3 | |
Cycle time | 1.8 [sec/chip] *4 with an optional chip loader | |
Alignment accuracy (3σ) | ±2 [µm] (X, Y) *5 | |
Bonding force [N] | Ultra-low pressure head : 0.049-9.8 | |
Standard head : 1.96-294 | ||
High pressure head for ultrasonic : 9.8-392 | ||
Low Pressure head for ultrasonic : 2.0-50 | ||
Heat tool temperature [°C] | RT-450 Ceramic heater (Thermo-compression) | |
Horn temperature [°C] (Ultrasonic-processing) | RT, 100, 150, 180, 200 | |
Power | 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA | |
Air pressure [MPa] | Dry air 0.49 | |
Vacuum [kPa] | -80 | |
Equipment dimensions [mm] | Approx. 1300W × 1240D × 1970H | |
Weight [kg] | Approx.1500 |
Notes
*1 Larger size substrates (MAX. 300L × 250W) can be processed with an optional S-axis.
*2 Chips, up to 10 different types, can be loaded with an optional multiple chip loader.
*3 Faced-up chip types can be loaded with an optional chip loader.
*4 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*5 Accuracy measurement is conducted using Toray-standard substrates.
Process option
Applications | NCP | ACP | ACF | Solder | Au-Sn | Au-Au | Ag Paste |
---|---|---|---|---|---|---|---|
Ultra-low pressure head | △*1 | ◯ | ◯ | △*1 | △*1 | ◯ | |
Standard head | ◯ | ◯ | ◯ | ◯ | ◯ | ◯ | |
Ceramic heat stage | ◯ | ||||||
Paste transfer | ◯ | ◯ | |||||
Dispenser | ◯ | ◯ | |||||
N2 Purge | ◯ | ||||||
Z-axis control | ◯ | ||||||
Ultrasonic engine | ◯ |
Notes
*1 Required in the case that there are only a few bumps.
Options
- Glass backup stage
- S-axis attachment (for larger substrates)
- Load cell
- Ionizer
- Vacuum pump
- Chip loader (tray / multiple types) *
- Substrate loader / unloader *
- Automatic thermo-calibration
- Data logger
Notes
* By adding a chip loader unit and a substrate loader / unloader unit a fully automatic process can be obtained.