Flip Chip Bonder (for Chip on Chip) FC2000X



Substrate size [mm] 2L × 2W-20L × 20W, t=0.1-1.6
Substrate types Si, GaAs, Glass Epoxy, FPC, Ceramics, etc.
Chip size [mm] 0.2L × 0.2W-10L × 10W, t=0.05-1.0
Number of chip types 1-2
Chip orientation Face down or Face up
Cycle time *1 12 [sec/chip]
Alignment accuracy (3σ) *2 ±2 [µm] (X, Y)
Bonding force [N] Ultra-low pressure head : 0.049-9.8
Heat tool temperature [°C] RT-450 Ceramic heater (Thermo-compression)
Heated stage temperature [°C] RT-450 Ceramic heater (Thermo-compression)
Power 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 6kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -90
Equipment dimensions [mm] Approx. 1300W × 1300D × 2050H (subject to change)
Weight [kg] Approx.1600 (subject to change)

*1 Cycle time does not include processing time (i.e. loading, bonding and vacuum release).
*2 Accuracy measurement is conducted using Toray-standard substrates.

Optional items

  1. Air-Conditioning unit
  2. Ionizer
  3. Vacuum pump
  4. Automatic camera calibration
  5. Data logger
Flip Chip Bonder (for Chip on Chip) FC2000X
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Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
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Flip Chip Bonder (for RF-ID Tag) CF2000R
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