Flip Chip Bonder (for SiP/COC/CSP ) FC3000

Features

Specifications

Substrate size [mm] 80L × 40W-250L × 80W  t=0.2-1
Substrate types Glass Epoxy, FPC, Ceramics, etc.
Chip size [mm] Thermo-compression process *1 3L × 3W-20L × 20W t=0.05-1
Ultrasonic bonding process *2 3L × 3W-15L × 15W t=0.3-0.8
Ultra low pressure bonding process 3L × 3W-10L × 10W t=0.05-1
Number of chip types Wafer : 1, Waffle tray : Max 3
Chip orientation *3 Face up (Wafer 6”, 8”, 12” or Waffle tray 2”, 3”, 4”)
Cycle time *4 1.7 [sec/chip]
Alignment accuracy (3σ) *5 ±2 [µm] (X, Y)
Bounding force [N] High-stiffness head 4.9-490
Ultra low pressure head 0.049-19.8
Bonding head type Ultrasonic head 50kHz, 150W temperature RT, 100 [°C] , 150 [°C] , 180 [°C] , 200 [°C]
Ceramic heater head temperature RT-450 [°C]
Power 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 1730W × 1420D × 1600H (Dimensions of substrate loading / unloading unit are not included)
Weight [kg] Approx. 2200 (Weights of substrate loading / unloading unit are not included)
Standard function High-stiffness head 
Z-axis control 
Automatic thermo-calibration 
Automatic coplanarity adjustment
Data logger 

Notes
*1 Slim chip (Min. 1.0mm Wide) and large-sized chip (Max. 30.0mm Long × 30.0mm wide) can be processed with an optional heat tool.
*2 Slim chip (Min. 1.0mm Wide) and long chip (Max. 28.0mm Long × 10.0mm wide) can be processed with an optional horn.
*3 12" wafer and waffle tray can be processed with options.
*4 Cycle time dose not include processing time (i.e. loading, bonding and vacuum release).
*5 Accuracy measurement is taken using Tray-standard substrates.

Process

The system is exchangeable among ultrasonic bonding process, thermo-compression process and solder process, by a simple change-over.

Process

Options

  1. Glass backup stage
  2. Vacuum pump
  3. Ionizer
  4. Wafer mapping
  5. Pre-heat & post-heat stage
  6. Ceramic heat stage (20 × 20mm)
  7. N2 Purge
  8. Main bonding unit
  9. Dispenser unit
  10. Constant temperature oven for substrate
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Bonders
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Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Flip Chip Bonder (for RF-ID Tag) CF2000R
Inquiry
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