Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500

Features

Specifications

  MD3000 MD3500
Substrate size [mm] 250L × 250W-560L × 640W t=0.05-1
Substrate types Glass, Epoxy, Cu foil, etc.
Chip size [mm] 0.8L × 0.8W-20L × 20W t=0.1-1
Number of chip types 1-4
Chip bonding direction Face up Face down (Face up possible with an optional unit)
Chip orientation Face up (Wafer 6", 8", 12" or Waffle Tray 2", 3", 4")
Cycle time *1 2.4 [sec/chip] (Face up) 2.0 [sec/chip] (Face Down)
2.5 [sec/chip] (Face up : Option)
Alignment accuracy (3σ) *2 ±5 [µm] (X, Y)
Bonding force [N] 0.49-49
Heat tool temperature [°C] RT-80 Constant heater RT-450 Ceramic heater
Stage temperature [°C] RT-200
Power 3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 20kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 2960W × 1810D × 1890H
Weight [kg] Approx. 3000

Notes
*1 Under the global alignment mode. Excluding processing time for loading, bonding, and vacuum release.
*2 Accuracy measurement is taken using Toray-standard substrates.

Process

Embedded Package ‐Chip Placement Method

MD3000

Process

MD3500

Process

Options

  1. Wafer changer
  2. Vacuum pump
  3. Ionizer
  4. Wafer mapping
  5. Dispenser
  6. Face up unit (for MD3500)
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Bonders
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Flip Chip Bonder (for RF-ID Tag) CF2000R
Inquiry
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