Super High Accuracy Flip Chip Bonder (for optical devices) OF2000

Features

Specifications

Substrate size [mm] 2L × 2W-20L × 20W
Chip dimensions [mm] 0.2L × 0.2W-10L × 10W
Cycle time (*1) 15 [sec/chip] + substrate handling 15 [sec]
Alignment accuracy (3σ) ±0.5 [µm] (X,Y) ±0.2° (θ) *2
Bonding force [N] 0.049-9.8
Heat tool temperature [°C] RT-500 Ceramic heater
Heat stage temperature [°C] RT-500 Ceramic heater
Power 3-phase, AC200V ±10%, 50Hz/60Hz or 3-phase, AC220V ±10%, 50Hz/60Hz, 10kVA
Air pressure [MPa] Dry air 0.49
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 2300W × 1500D × 1760H
Weight [kg] Approx. 2000

Notes
*1 Does not include processing time (i.e. head touchdown, bonding and vacuum release).
*2 Distance between makes is 160µm

Options

  1. IR bonding inspection unit
    • Measurement with IR transmission of the chip position to the substrate after bonding
  2. Auto-control parallel function for chip and substrate
  3. Active anti-vibration device
    • Super high accuracy with shortest cycle time can be obtained by controlling vibration from source internal and external to the machine.
  4. 2 purge stage
  5. Data logger
  6. Ionizer
  7. Vacuum Pump
  8. Auto tool changer

New Approach for Optical Modules

New Approach for Optical Modules

Passive Alignment for LD Bonding

Passive Alignment for LD Bonding

 Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
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Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
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