Bonders

Toray Engineering has a complete line of flip chip bonders for a variety of applications, including CSP and other semiconductor packages, as well as optical devices, MEMS and COC.

Product List

Flip Chip Bonders

Flip Chip Bonder (for SiP/COC/CSP) FC3000S

A semi-automatic machine, suited for conducting R&D work and small amount of production.

Super High Accuracy Flip Chip Bonder (for optical devices) OF2000

Super high accuracy flip chip bonder for optical devices, boasting bonding accuracy at the highest level in the world

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Semiconductors
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