Bonders

Toray Engineering has a complete line of flip chip bonders for a variety of applications, including CSP and other semiconductor packages, as well as optical devices, MEMS, COC and RFID.

Product List

Flip Chip Bonders

Flip Chip Bonder (for SiP/COC/CSP ) FC3000

Flip chip bonder which can be switched to either the thermo-compression process or ultrasonic bonding process with a change-over

Flip Chip Bonder (for SiP/COC/CSP) FC3000S

A semi-automatic machine, suited for conducting R&D work and small amount of production.

Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500

Flip chip bonder ideal for embedded bonding

Super High Accuracy Flip Chip Bonder (for optical devices) OF2000

Super high accuracy flip chip bonder for optical devices, boasting bonding accuracy at the highest level in the world

Flip Chip Bonder (for MCM/COF/CSP) FC2000 series

Flip chip bonder which can be switched to either the thermo-compression process or ultrasonic bonding process with a change-over

Flip Chip Bonder (for Chip on Chip) FC2000X

With a chip loading unit and a substrateloading /unloading unit equipped as standard specification, the machine is also suitable for volume production.

Manual Type Flip Chip Bonder (for R&D Purpose) FC100M

Manual flip chip bonder ideal for R&D applications

Flip Chip Bonder for Surface Activated COC FC2000 (CoC)

Chip on chip bonder enabling surface activated room temperature bonding

RF-ID Manufacturing Equipment

Flip Chip Bonder (for RF-ID Tag) CF2000R

Flip Chip Bonder for RF-ID Tag, Compatible with IC cards and IC tags

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