Flip Chip Bonder (for RF-ID Tag) CF2000R

Features

Specification

Application RFID & Contactless smart card
Process ACP, NCP
Substrate dimensions Roll Width : 250-500mm, Thickness : 50-200µm, Web size :Φ500mm
Substrate materials PET, PET-G, PI, etc
Chip dimensions 0.5 × 0.5-3.0 × 3.0mm, Thickness : 0.1-0.5mm
Chip supply & orientation Wafer (Max. 8"). Chip tray (Face down)
Cycle time per chip 0.5sec (1.0sec in case of ±30µm alignment accuracy requirement)
Alignment accuracy ±50µm at 3σ
Heated tool temperature [°C] RT-350 (Main bonding head)
Bonding force [N] 0.49-6.86
Power 3-phase, AC200V ±5%, 50Hz/60Hz or 3-phase, AC220V ±5%, 50Hz/60Hz, 30kVA
Air pressure [MPa] Dry air 0.4-6.86
Vacuum [kPa] -80
Equipment dimensions [mm] Approx. 11,555W × 2,210D × 1,428H
Weight [kg] Approx. 9,500

Optional items

  1. Antenna testing unit
  2. Function testing unit
  3. Paste printer
  4. Sheet cutter unit
  5. Bonding profile control system
  6. Ionizer
  7. Vacuum pump
 Flip Chip Bonder (for RF-ID Tag) CF2000R
Bonders
Flip Chip Bonder (for SiP/COC/CSP ) FC3000
Flip Chip Bonder (for SiP/COC/CSP) FC3000S
Bonder for Large-sized Substrates (Applications: Embedded Packaging etc.) MD3000/3500
Super High Accuracy Flip Chip Bonder (for optical devices) OF2000
Flip Chip Bonder (for MCM/COF/CSP) FC2000 series
Flip Chip Bonder (for Chip on Chip) FC2000X
Manual Type Flip Chip Bonder (for R&D Purpose) FC100M
Flip Chip Bonder for Surface Activated COC FC2000 (CoC)
Flip Chip Bonder (for RF-ID Tag) CF2000R
Inquiry
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