Encapsulation
Product List
Vacuum Printing Encapsulation System
Vacuum Printing Encapsulation System VE500C
A semi-automatic machine, suited for conducting R&D work and high volume of production.
Vacuum Printing Encapsulation System VE700
The system is applicable to batch encapsulation of 12 inch wafer.
Vacuum Printing System VE6500
The system ensures achievement of void-less via-hole filling.
ex) FOWLP (Fan out Wafer Level Package), Large size panel etc.
Applications
(1) IC Package
①Encapsulation/Mold of BGA・CSP
â‘¡Batch encapsulation of WLP (Wafer Level Package)
â‘¢MUF (Mold Under Fill)
â‘£EMI shield
(2) LED
â‘ Fluorescent resin printing
â‘¡Silicone resin encapsulation, LED lens
(3) PCB (Printed Circuit Board)
Blind-via/Through hole via filling
Process
Patent ： 3145959
