Encapsulation

Product List

Vacuum Printing Encapsulation System

Vacuum Printing Encapsulation System VE500C

A semi-automatic machine, suited for conducting R&D work and high volume of production.

Vacuum Printing Encapsulation System VE700

The system is applicable to batch encapsulation of 12 inch wafer.

Vacuum Printing System VE6500

The system ensures achievement of void-less via-hole filling.
ex) FOWLP (Fan out Wafer Level Package), Large size panel etc.

(1) IC Package

①Encapsulation/Mold of BGA・CSP

①Encapsulation/Mold of BGA・CSP

â‘¡Batch encapsulation of WLP (Wafer Level Package)

â‘¡Batch encapsulation of WLP (Wafer Level Package)

â‘¢MUF (Mold Under Fill)

â‘¢MUF (Mold Under Fill)

â‘£EMI shield

â‘£EMI shield

(2) LED

â‘ Fluorescent resin printing

â‘ Fluorescent resin printing

â‘¡Silicone resin encapsulation, LED lens

â‘¡Silicone resin encapsulation, LED lens

(3) PCB (Printed Circuit Board)

Blind-via/Through hole via filling

Blind-via/Through hole via filling


Process

Patent : 3145959

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Semiconductors
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