Vacuum Printing Encapsulation System VE500C

Features

Specifications

Packages BGA, CSP, COB, WLP, LED etc.
Printing area 200W × 200L [mm]
Vacuum level (Max) 130Pa
Print head Double squeegee
Resin supply method Dispenser
Equipment dimensions Approx. 1,800W × 1,000D × 1,600H [mm]
Weight Approx. 1,200 [kg]
Power 3-phase AC200±10%, 50Hz/60Hz or 3-phase AC220±10%, 50Hz/60Hz, 18kV

Process

Patent : 3145959

Process

Options

  1. CCD camera monitor
  2. Substrate loading / unloading unit
  3. Image processor
  4. Silent box for vacuum pump
Encapsulation
Vacuum Printing Encapsulation System VE500C
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