Surface Profiler measurement system "SP series"

"Make the impossible, POSSIBLE", the product with transparent film should be mesured by "SP".
* High scanning speed, Measurement image resolution for height direction uses nano-level.*
Swiftly and flexibly meet the diversified needs of a wide application from R&D to FA with high technology such as film thickness measurement, surface roughness measurement, high accuracy 3D measurement and so on.


SP series, High accuracy 3D surface profiler measurement system with white light interferometry.


Transparent film measurement system

It is possible to measure up to 50nm thin film and transparent film, moreover the product with transparent film impreviously by "Our original algorithm".

The product with a film which is not able to be measured by other system nor other algorithm can be measured with sufficient accuracy.

Measurement of ….

High scanning speed

Vertical scanning speed : 214µm/sec
* meet the needs of making quick scanning time possible as market requests

Bump and TSV automated measurement with automated asperity measurement

Micro bump, TSV, deep-trench can be contactless measured with high accuracy "Automated asperity measurement" can measure the following items.


Range of models for different applications.

  SP-700/500 SP-700A/500A SP-700WA/500WA SP-700M/500M
Equipment SP-700/500 SP-700A/500A SP-700WA/500WA SP-700M/500M
Size of a stage 150mm×150mm 200mm×200mm wafer:2-8inch/8,12inch
Product Line-up Manual Type Semi-Automatic type For wafers Module type
Interference objective lens 2x, 5x, 10x, 20x, 50x
CCD camera Standard : 1/3" (512×480 effective pixels)
Option : 2/3" (1,376×1,040 effective pixels)
Height display resolution 0.001um/0.01nm(switchable)
Pixel resolution 0.13um~
Vertical scanning range 0-100um
Measurement examples Bumps, Trench, Wafer roughness,LED(PSS), SiC Etchi-Pits,Film,Tranceparent Film,PV,etc…
Wafer inspection system "INSPECTRA" series
Chip Inspection System GEN3000T
Surface Profiler measurement system "SP series"
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